- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/4763 - Deposition of non-insulating-, e.g. conductive-, resistive-, layers on insulating layers; After-treatment of these layers
Patent holdings for IPC class H01L 21/4763
Total number of patents in this class: 2498
10-year publication summary
225
|
184
|
157
|
93
|
58
|
61
|
34
|
12
|
7
|
0
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
311 |
Samsung Electronics Co., Ltd. | 131630 |
173 |
GLOBALFOUNDRIES U.S. Inc. | 6459 |
141 |
Micron Technology, Inc. | 24960 |
115 |
International Business Machines Corporation | 60644 |
100 |
Texas Instruments Incorporated | 19376 |
88 |
Renesas Electronics Corporation | 6305 |
69 |
United Microelectronics Corp. | 3921 |
65 |
Hynix Semiconductor Inc. | 2644 |
54 |
Applied Materials, Inc. | 16587 |
39 |
SK Hynix Inc. | 11030 |
39 |
Kioxia Corporation | 9847 |
37 |
Semiconductor Energy Laboratory Co., Ltd. | 10902 |
36 |
Advanced Micro Devices, Inc. | 5326 |
34 |
Infineon Technologies AG | 8189 |
33 |
Semiconductor Manufacturing International (Shanghai) Corporation | 1764 |
32 |
Boe Technology Group Co., Ltd. | 35384 |
31 |
Macronix International Co., Ltd. | 2562 |
29 |
Intel Corporation | 45621 |
28 |
Tokyo Electron Limited | 11599 |
27 |
Other owners | 1017 |